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 Smart High-Side Power Switch BTS740S2
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Data Sheet
1
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
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PROFET
Pin Definitions and Functions
Pin 1,10, 11,12, 15,16, 19,20 3 7 17,18 13,14 Symbol Function Vbb Positive power supply voltage. Design the wiring for the simultaneous max. short circuit currents from channel 1 to 2 and also for low thermal resistance IN1 Input 1,2, activates channel 1,2 in case of IN2 logic high signal OUT1 Output 1,2, protected high-side power output OUT2 of channel 1,2. Both pins of each output have to be connected in parallel for operation according ths spec (e.g. kilis). Design the wiring for the max. short circuit current ST1 Diagnostic feedback 1,2 of channel 1,2, ST2 open drain, invers to input level GND1 Ground 1 of chip 1 (channel 1) GND2 Ground 2 of chip 2 (channel 2) IS1 Sense current output 1,2; proportional to the load current, zero in the case of current IS2 limitation of the load current
2
Pin configuration
(top view)
4 8 2 6 5 9
Vbb GND1 IN1 ST1 IS1 GND2 IN2 ST2 IS2 Vbb
1 2 3 4 5 6 7 8 9 10
*
20 19 18 17 16 15 14 13 12 11
Vbb Vbb OUT1 OUT1 Vbb Vbb OUT2 OUT2 Vbb Vbb
Data Sheet
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Maximum Ratings at Tj = 25C unless otherwise specified
Parameter Supply voltage (overvoltage protection see page 5) Supply voltage for full short circuit protection Tj,start = -40 ...+150C Load current (Short-circuit current, see page 5) Load dump protection1) VLoadDump = VA + Vs, VA = 13.5 V RI2) = 2 , td = 200 ms; IN = low or high, each channel loaded with RL = 7.0 , Operating temperature range Storage temperature range Power dissipation (DC)4) Ta = 25C: (all channels active) Ta = 85C: Maximal switchable inductance, single pulse Vbb = 12V, Tj,start = 150C4), IL = 5.5 A, EAS = 370 mJ, 0 one channel: IL = 8.5 A, EAS = 790 mJ, 0 two parallel channels:
see diagrams on page 10
Symbol
Values 43 34 self-limited 60 -40 ...+150 -55 ...+150 3.8 2.0
Unit V V A V C W
Vbb Vbb IL VLoad dump3) Tj Tstg Ptot
ZL
18 16 1.0 4.0 8.0 -10 ... +16 2.0 5.0 14
mH
Electrostatic discharge capability (ESD) IN: VESD (Human Body Model) ST, IS: out to all other pins shorted:
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993 R=1.5k; C=100pF
kV
nput voltage (DC) Current through input pin (DC) Current through status pin (DC) Current through current sense pin (DC)
see internal circuit diagram page 9
VIN IIN IST IIS
V mA
Thermal Characteristics
Parameter and Conditions Symbol min Thermal resistance junction - soldering point4),5) each channel: Rthjs 4) junction - ambient one channel active: Rthja all channels active: ---Values typ Max -40 33 12 --Unit
K/W
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150 resistor for the GND connection is recommended. ) R = internal resistance of the load dump test pulse generator I )V Load dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 ) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for V bb connection PCB is vertical without blown air See page 15 Data Sheet 3 V1.0, 2007-05-13
)
Smart High-Side Power Switch BTS740S2
Parameter and Conditions, each of the two channels
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Load Switching Capabilities and Characteristics On-state resistance (Vbb to OUT); IL = 5 A each channel, Tj = 25C: RON Tj = 150C: two parallel channels, Tj = 25C: Output voltage drop limitation at small load currents, see page 14
IL = 0.5 A Tj =-40...+150C:
--
27 54 14
30 60 15 ---
m
VON(NL)
-4.9 7.8 -25 25 0.1 0.1
50 5.5 8.5 -70 80 ---
mV A
Nominal load current
one channel active: IL(NOM) two parallel channels active:
Device on PCB6), Ta = 85C, Tj 150C
Output current while GND disconnected or pulled up7); IL(GNDhigh)
Vbb = 30 V, VIN = 0, see diagram page 10
8
150 200 1 1
mA
s
Turn-on time8) IN Turn-off time IN RL = 12 Slew rate on 8) 10 to 30% VOUT, RL = 12 : Slew rate off 8) 70 to 40% VOUT, RL = 12 :
Operating Parameters Operating voltage9) Undervoltage shutdown Undervoltage restart
to 90% VOUT: ton to 10% VOUT: toff dV/dton -dV/dtoff
V/s V/s
Vbb(on) Vbb(under) Tj =-40...+25C: Vbb(u rst) Tj =+150C: Undervoltage restart of charge pump see diagram page 13 Tj =-40...+25C: Vbb(ucp) Tj =150C: Undervoltage hysteresis Vbb(under)
Vbb(under) = Vbb(u rst) - Vbb(under)
5.0 3.2 ----34 33
--4.5 4.7 -0.5 ---
34 5.0 5.5 6.0 6.5 7.0 -43 --
V V V V V V V
Overvoltage shutdown Overvoltage restart
6) 7) 8) 9)
Vbb(over) Vbb(o rst)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb connection. PCB is vertical without blown air. See page 15 not subject to production test, specified by design See timing diagram on page 11. At supply voltage increase up to Vbb= 4.7 V typ without charge pump, VOUT Vbb - 2 V
4 V1.0, 2007-05-13
Data Sheet
Smart High-Side Power Switch BTS740S2
Parameter and Conditions, each of the two channels
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max -41 43 ---1 -47 8 24 ---52 30 50 20
Unit
Vbb(over) Tj =-40: Vbb(AZ) Ibb=40 mA Tj =+25...+150C: Standby current11) Tj =-40C...25C: Ibb(off) VIN = 0; Tj =150C: Leakage output current (included in Ibb(off)) IL(off) VIN = 0 Operating current 12), VIN = 5V, IGND = IGND1 + IGND2, one channel on: IGND two channels on: Overvoltage hysteresis Overvoltage protection10) Protection Functions13) Current limit, (see timing diagrams, page 12)
V V A A
---
1.2 2.4
3 6
mA
Tj =-40C: IL(lim) Tj =25C: Tj =+150C:
Repetitive short circuit current limit, Tj = Tjt each channel IL(SCr) two parallel channels
(see timing diagrams, page 12)
48 40 31 ----
56 50 37 24 24 2.0
65 58 45 ----
A
A
Initial short circuit shutdown time
Tj,start =25C: toff(SC)
ms
(see timing diagrams on page 12)
Output clamp (inductive load switch off)14) at VON(CL) = Vbb - VOUT, IL= 40 mA Tj =-40C: VON(CL) Tj =25C...150C: Thermal overload trip temperature Tjt Thermal hysteresis Tjt
41 43 150 --
-47 -10
-52 ---
V C K
10)
11) 12) 13
14)
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150 resistor in the GND connection is recommended). See also VON(CL) in table of protection functions and circuit diagram page 9. Measured with load; for the whole device; all channels off Add IST, if IST > 0 Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation. If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest VON(CL)
5 V1.0, 2007-05-13
Data Sheet
Smart High-Side Power Switch BTS740S2
Parameter and Conditions, each of the two channels
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Reverse Battery Reverse battery voltage 15) Drain-source diode voltage (Vout > Vbb) IL = - 4.0 A, Tj = +150C Diagnostic Characteristics Current sense ratio16), static on-condition,
VIS = 0...5 V, Vbb(on) = 6.517)...27V, kILIS = IL / IIS Tj = -40C, IL = 5 A:
-Vbb -VON
---
-600
32 --
V mV
kILIS
Tj= -40C, IL= 0.5 A: Tj= 25...+150C, IL= 5 A: Tj= 25...+150C, IL = 0.5 A: Current sense output voltage limitation
Tj = -40 ...+150C IIS = 0, IL = 5 A:
4350 3100 4350 3800
4800 4800 4800 4800 6.1 ----30 10 3 15
5800 7800 5350 6300 6.9 1 15 10 300 100 -4 40 V A
VIS(lim) IIS(LL) IIS(LH) IIS(SH) 18) tson(IS)
5.4 0 0 0 ---2 5
Current sense leakage/offset current Tj = -40 ...+150C VIN=0, VIS = 0, IL = 0: VIN=5 V, VIS = 0, IL = 0: VIN=5 V, VIS = 0, VOUT = 0 (short circuit) Current sense settling time to IIS static10% after 5A positive input slope18), IL = 0
s s s V k
Current sense settling time to 10% of IIS static after 0A tsoff(IS) negative input slope18), IL = 5 Current sense rise time (60% to 90%) after change 5A tslc(IS) of load current18) IL = 2.5 Open load detection voltage19) (off-condition) Internal output pull down (pin 17,18 to 2 resp. 13,14 to 6), VOUT=5 V
VOUT(OL) RO
Requires a 150 resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 3 and circuit page 9). 16) This range for the current sense ratio refers to all devices. The accuracy of the k can be raised at least by ILIS a factor of two by matching the value of kILIS for every single device. In the case of current limitation the sense current IIS is zero and the diagnostic feedback potential VST is High. See figure 2c, page 12. 17) Valid if V bb(u rst) was exceeded before. 18) not subject to production test, specified by design 19) External pull up resistor required for open load detection in off state Data Sheet 6 V1.0, 2007-05-13
15)
Smart High-Side Power Switch BTS740S2
Parameter and Conditions, each of the two channels
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified
Symbol
Values min typ max
Unit
Input and Status Feedback20) Input resistance
(see circuit page 9)
RI VIN(T+) VIN(T-) VIN(T) IIN(off) IIN(on) td(ST OL3) tdon(ST) tdoff(ST)
3.0 -1.5 -1 20 --
4.5 --0.5 -50 400
7.0 3.5 --50 90 --
k V V V A A s s s V
Input turn-on threshold voltage Input turn-off threshold voltage Input threshold hysteresis Off state input current VIN = 0.4 V: On state input current VIN = 5 V: Delay time for status with open load after Input neg. slope (see diagram page 13) Status delay after positive input slope
(not subject to production test, specified by design)
--5.4 ----
13 1 6.1 ----
--6.9 0.4 0.7 2
Status delay after negative input slope
(not subject to production test, specified by design)
Status output (open drain) Zener limit voltage Tj =-40...+150C, IST = +1.6 mA: VST(high) ST low voltage Tj =-40...+25C, IST = +1.6 mA: VST(low) Tj = +150C, IST = +1.6 mA: Status leakage current, VST = 5 V, Tj=25 ... +150C: IST(high)
A
20)
If ground resistors RGND are used, add the voltage drop across these resistors.
Data Sheet
7
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Truth Table
Input 1 Input 2 level Normal operation Currentlimitation Short circuit to GND Overtemperature Short circuit to Vbb Open load Undervoltage Overvoltage L H L H L H L H L H L H L H L H L Output 1 Output 2 level L H L H L L21) L L H H L24) H L L L L L Status 1 Status 2 level H L H H H H H H L22) L H (L25)) L H L H L H Current Sense 1 Current Sense 2 IIS 0 nominal 0 0 0 0 0 0 0 Negative output voltage clamp L = "Low" Level X = don't care Z = high impedance, potential depends on external circuit H = "High" Level Status signal after the time delay shown in the diagrams (see fig 5. page 13) Parallel switching of channel 1 and 2 is possible by connecting the inputs and outputs in parallel. The status outputs ST1 and ST2 have to be configured as a 'Wired OR' function with a single pull-up resistor. The current sense outputs IS1 and IS2 have to be connected with a single pull-down resistor.
Terms
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Leadframe (Vbb) is connected to pin 1,10,11,12,15,16,19,20 External RGND optional; two resistors RGND1, RGND2 = 150 or a single resistor RGND = 75 for reverse battery protection up to the max. operating voltage. The voltage drop over the power transistor is Vbb-VOUT > 3V typ. Under this condition the sense current IIS is zero 22) An external short of output to V , in the off state, causes an internal current from output to ground. If R bb GND is used, an offset voltage at the GND and ST pins will occur and the VST low signal may be errorious. 23) Low ohmic short to V may reduce the output current I and therefore also the sense current I . bb L IS 24) Power Transistor off, high impedance Data Sheet 8 V1.0, 2007-05-13
21)
Smart High-Side Power Switch BTS740S2
Input circuit (ESD protection), IN1 or IN2
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Inductive and overvoltage output clamp,
OUT1 or OUT2
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The use of ESD zener diodes as voltage clamp at DC conditions is not recommended.
Status output, ST1 or ST2
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VON clamped to VON(CL) = 47 V typ.
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Overvoltage and reverse batt. protection
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ESD-Zener diode: 6.1 V typ., max 5.0 mA; RST(ON) < 375 at 1.6 mA. The use of ESD zener diodes as voltage clamp at DC conditions is not recommended.
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Current sense output
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VZ1 = 6.1 V typ., VZ2 = 47 V typ., RGND = 150 , RST=15k, RI=4.5k typ., RIS=1k, RV=15k, In case of reverse battery the current has to be limited by the load. Temperature protection is not active
Open-load detection OUT1 or OUT2
ESD-Zener diode: 6.1 V typ., max 14 mA; RIS = 1 k nominal OFF-state diagnostic condition: VOUT > 3 V typ.; IN low
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Data Sheet
9
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
GND disconnect
Inductive load switch-off energy dissipation
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Any kind of load. In case of IN = high is VOUT VIN - VIN(T+). Due to VGND > 0, no VST = low signal available.
Energy stored in load inductance:
GND disconnect with GND pull up
EL = 1/2*L*I L
While demagnetizing load inductance, the energy dissipated in PROFET is
2
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9EE 352)(7 287
EAS= Ebb + EL - ER= VON(CL)*iL(t) dt,
with an approximate solution for RL > 0 : IL* L (V + |VOUT(CL)|) 2*RL bb IL*RL
67 *1'
EAS=
OQ (1+ |V
OUT(CL)|
)
9
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Maximum allowable load inductance for a single switch off (one channel)4)
/ I ,/ Tj,start = 150C, Vbb = 12 V, RL = 0
Any kind of load. If VGND > VIN - VIN(T+) device stays off Due to VGND > 0, no VST = low signal available.
ZL [mH]
Vbb disconnect with energized inductive load
KLJK
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For inductive load currents up to the limits defined by ZL (max. ratings and diagram on page 10) each switch is protected against loss of Vbb. Consider at your PCB layout that in the case of Vbb disconnection with energized inductive load all the load current flows through the GND connection.

Data Sheet
10
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Timing diagrams
Both channels are symmetric and consequently the diagrams are valid for channel 1 and channel 2
Figure 1a: Switching a resistive load, change of load current in on-condition:
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Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition:
,1
W don(ST)
W doff(ST)
9287
W on G9GWRQ W G9GWRII
9287 W on W off W slc(IS) W slc(IS)
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off
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/RDG
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W
W soff(IS)
W
The sense signal is not valid during settling time after turn or change of load current.
Figure 1b: Vbb turn on: ,1
Figure 2b: Switching a lamp:
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proper turn on under all conditions
Data Sheet
11
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Figure 2c: Switching a lamp with current limit:
Figure 3a: Turn on into short circuit: shut down by overtemperature, restart by cooling
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Heating up of the chip may require several milliseconds, depending on external conditions
Figure 2d: Switching an inductive load
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Figure 3b: Turn on into short circuit: shut down by overtemperature, restart by cooling (two parallel switched channels 1 and 2)
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ST1 and ST2 have to be configured as a 'Wired OR' function ST1/2 with a single pull-up resistor
Data Sheet
12
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Figure 4a: Overtemperature: Reset if Tj ,1
Figure 6a: Undervoltage:
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bb(under)
Vbb(u cp) 9bb(u rst)
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Figure 6b: Undervoltage restart of charge pump
Figure 5a: Open load: detection (with REXT), turn on/off to open load
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charge pump starts at Vbb(ucp) =4.7 V typ.
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Data Sheet
13
V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Figure 7a: Overvoltage:
Figure 8b: Current sense ratio:
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9bb
V ON(CL)
V
bb(over)
V
bb(o rst)
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Figure 8a: Current sense versus load current26::
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Figure 9a: Output voltage drop versus load current:
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26
This range for the current sense ratio refers to all devices. The accuracy of the kILIS can be raised at
14 V1.0, 2007-05-13
Data Sheet
Smart High-Side Power Switch BTS740S2
Package Outlines
2.65 max
0.35 x 45
2.45 -0.2
0.2 -0.1
1.27 0.35
+0.15 2)
0.4 +0.8 0.2 24x 20 11 0.1 10.3 0.3
GPS05094
1 12.8 1) 10 -0.2 Index Marking 1) Does not include plastic or metal protrusions of 0.15 max per side 2) Does not include dambar protrusion of 0.05 max per side
Figure 1
PG-DSO-20 (Plastic Dual Small Outline Package) (RoHS-compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). Please specify the package needed (e.g. green package) when placing an order
You can find all of our packages, sorts of packing and others in our Infineon Internet Page "Products": http://www.infineon.com/products. Data Sheet 17
0.23 +0.0 9 8 ma x
7.6 -0.2 1)
Dimensions in mm V1.0, 2007-05-13
Smart High-Side Power Switch BTS740S2
Revision History
Version 1.0 Date 2007-05-13 Changes Creation of the green datasheet.
Data Sheet
18
V1.0, 2007-05-13
Edition 2007-05-13 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 5/13/07. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ("Beschaffenheitsgarantie"). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.


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